详细描述
SMD Mini Molding Power Inductors HI201610P - HI322512P Series
|
Series |
Dimensions (mm) |
Inductance |
Isat |
Specification |
||
|
L |
W |
H |
||||
|
HI201610P |
2.0 |
1.6 |
1.0 |
0.24uH - 2.2uH |
1.71A - 5.05A |
 |
|
HI252010P |
2.5 |
2.0 |
1.0 |
0.33uH - 4.7uH |
1.62A - 6A |
|
|
HI252012P |
2.5 |
2.0 |
1.2 |
0.47uH - 4.7uH |
1.4A - 4.95A |
|
Characteristics
Magnetic iron alloy allows high rated currents
Compact design, Magnetically shielded
High current capability and handles high transient current spikes
Low acoustic noise and low leakage flux noise
Operating temperature: –40 °C to 125 °C
Applications
DC/DC-converter for high current power supplies
DC/DC-converter for Field Programmable Gate Array (FPGA)
POL-converters, Portable power like PDA, digital camera
Mainboards/graphic cards, Battery powered devices
Wireless communication devices
Power supplies for smartphones, tablet PCs and other mobile devices
